Vo Vong,a Luu tien Hung,b Steffen Schulze,c and Michael
Hietscholdc
aLaboratory of
Electron Microscopy - National Centre for Natural Science and Technology, 18
Hoangquocviet Str., Caugiay Hanoi, Vietnam; bDepartment of
Physics, Vinh University, Vinh City, Nghean, Vietnam; cInstitute of
Physics, Chemnitz University of Technology, D-09107 Germany
(vvemlab@ncst.ac.vn)
The grain sizes, phases, structures and
morphology of Ta and TaNx thin films on Si and SiO2
substrates, which belong to the most promising barrier materials for copper in
interconnect systems of semiconductor devices were determined by using high
resolution electron microscopy (HREM).
In this work, we present the sample
preparation of these films for TEM plan-view investigations. Special efforts
had to be made in order to reach electron transparency despite of the high
internal stress in the thin films. In detail, we discuss the grain sizes,
phases and structures of the films and alloys as deduced from bright-field and
dark-field images and selected area electron diffraction patterns.
Keywords : Size, structure , dark-field , SAD